Ultralow Thermal Conductivity and Thermal Stress of Ceramics with Surface Nanowire-structures
Electronic Archive of Sumy State University
Переглянути архів Інформація| Поле | Співвідношення | |
| Title |
Ultralow Thermal Conductivity and Thermal Stress of Ceramics with Surface Nanowire-structures
|
|
| Creator |
Liang, L.H.
Wei, Y.G. |
|
| Subject |
Nanowires
Thermal conductivity Elastic modulus Thermal stress |
|
| Description |
An analytical model on the size and fraction dependent thermal conductivity, elastic modulus and thermal stress of nanowire-composites are developed, and the theoretical prediction agrees with the experimental results of Si nanowires. And the model proposes that the high thermal shock strength of ceramics can be achieved by surface nanostructurization, which is related to the low thermal conductivity and thermal stress of the nanostructures and voids. The theory will be helpful to guide design of thermal barrier coatings. |
|
| Publisher |
Sumy State University
|
|
| Date |
2014-05-23T07:41:50Z
2014-05-23T07:41:50Z 2012 |
|
| Type |
Article
|
|
| Identifier |
Liang, Yu.
Ultralow Thermal Conductivity and Thermal Stress of Ceramics with Surface Nanowire-structures / L. Liang, Y. Wei
// Nanomaterials: Applications & Properties (NAP-2012) : 2-nd International conference, Alushta, the Crimea, September 17-22, 2012 / Edited by: A. Pogrebnjak. - Sumy : Sumy State University, 2012. - V. 1, No2. - 02NFC15-02NFC15
http://essuir.sumdu.edu.ua/handle/123456789/34880 |
|
| Language |
en
|
|