Low-temperature deposition of silicon dioxide films in high-density plasma
Vernadsky National Library of Ukraine
Переглянути архів Інформація| Поле | Співвідношення | |
| Title |
Low-temperature deposition of silicon dioxide films in high-density plasma
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| Creator |
Yasunas, A.
Kotov, D. Shiripov, V. Radzionay, U. |
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| Description |
One of the basic operations in the LED (light-emitting diode) chip fabrication technique is formation of dielectric coatings for the purpose of insulation and surface passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or chemical vapor deposition techniques can act as such a coating. Low conformity of physical vapor deposition techniques limits the possibility of their application in a number of cases at LED mesostructures passivation. This work represents the results of experiments on silicon dioxide dielectric films deposition in the inductive coupled plasma under different operation conditions. The findings prove the possibility of lowtemperature deposition of thick silicon dioxide films with high conformality by the HDPCVD (high-density plasma chemical vapor deposition) technique. |
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| Date |
2017-05-26T10:11:01Z
2017-05-26T10:11:01Z 2013 |
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| Type |
Article
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| Identifier |
Low-temperature deposition of silicon dioxide films
in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ.
1560-8034 PACS 78.20.-e, 82.33.Xj http://dspace.nbuv.gov.ua/handle/123456789/117696 |
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| Language |
en
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| Relation |
Semiconductor Physics Quantum Electronics & Optoelectronics
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| Publisher |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
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