Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices
Vernadsky National Library of Ukraine
Переглянути архів Інформація| Поле | Співвідношення | |
| Title |
Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices
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| Creator |
Gavrysh, V.I.
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| Description |
The steady-state linear thermal conductivity problem for an isotropic layer with a thin foreign parallelepipedic inclusion that releases heat has been considered with account of heat dissipation. The methodology for analytic solution of three-dimensional steady-state boundary thermal conductivity problem has been suggested. |
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| Date |
2017-05-26T17:50:49Z
2017-05-26T17:50:49Z 2011 |
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| Type |
Article
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| Identifier |
Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices / V.I. Gavrysh // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2011. — Т. 14, № 4. — С. 478-481. — Бібліогр.: 7 назв. — англ.
1560-8034 PACS 74.25.fc http://dspace.nbuv.gov.ua/handle/123456789/117800 |
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| Language |
en
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| Relation |
Semiconductor Physics Quantum Electronics & Optoelectronics
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| Publisher |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
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