Thermal state modeling in thermosensitive elements of microelectronic devices with reach-through foreign inclusions
Vernadsky National Library of Ukraine
Переглянути архів Інформація| Поле | Співвідношення | |
| Title |
Thermal state modeling in thermosensitive elements of microelectronic devices with reach-through foreign inclusions
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| Creator |
Gavrysh, V.I.
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| Description |
The nonlinear boundary axially symmetric problem of heat conduction for the thermosensitive piecewise homogeneous layer with reach-through cylindrical inclusion that generates heat has been considered. Using the introduced function, the partial linearization of the original problem has been carried out. With the proposed piecewiselinear approximation of temperature at the boundary surface of the foreign inclusion and on the contact surface of the homogeneous elements of the layer, the problem has been completely linearized. The analytical solution of this problem of finding the introduced function using Hankel integral transform has been formed. The formulae for calculating the desired temperature have been derived. |
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| Date |
2017-05-29T16:50:26Z
2017-05-29T16:50:26Z 2012 |
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| Type |
Article
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| Identifier |
Thermal state modeling in thermosensitive elements of
microelectronic devices with reach-through foreign inclusions / V.I Gavrysh.// Semiconductor Physics Quantum Electronics & Optoelectronics. — 2012. — Т. 15, № 3. — С. 247-251. — Бібліогр.: 13 назв. — англ.
1560-8034 PACS 74.25.fc http://dspace.nbuv.gov.ua/handle/123456789/118314 |
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| Language |
en
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| Relation |
Semiconductor Physics Quantum Electronics & Optoelectronics
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| Publisher |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
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