Thermal simulation of heterogeneous structural components in microelectronic devices
Vernadsky National Library of Ukraine
Переглянути архів Інформація| Поле | Співвідношення | |
| Title |
Thermal simulation of heterogeneous structural components in microelectronic devices
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| Creator |
Gavrysh, V.I.
Fedasyuk, D.V. |
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| Description |
The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-conductivity coefficients on temperature has been offered. |
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| Date |
2017-05-31T05:34:02Z
2017-05-31T05:34:02Z 2010 |
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| Type |
Article
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| Identifier |
Thermal simulation of heterogeneous structural components
in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ.
1560-8034 PACS 74.25.fc http://dspace.nbuv.gov.ua/handle/123456789/118738 |
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| Language |
en
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| Relation |
Semiconductor Physics Quantum Electronics & Optoelectronics
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| Publisher |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
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