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| Поле | Співвідношення |
| Title | Acoustic emission application for nondestructive strength diagnostics of printed circuit boards |
| Names |
Ковтун, Ігор Іванович
Бойко, Юлій Миколайович Петращук, Світлана Анатоліївна Kovtun, I. Boiko, J. Petrashchuk, S. |
| Date Issued | 2018-01 (iso8601) |
| Abstract | The paper represents developing nondestructive method for strength diagnostics of solder joints on printed circuit boards with application of acoustic emission method. Solder joints studied in the current research were performed by throughhole technology. The research methods involved static mechanical tensile and bend tests, and acoustic emission method. First solder joint strength research was conducted by static mechanical tensile tests. The batch of solder joints were tested in three equal groups: solder joints, which had no defects; solder joints, which had “cold solder” defect; solder joints, which had “low solder adhesion” defect. The load was applied with the constant speed. During the test the following acoustic emission parameters were recorded: amplitude; activity; total count in order to assess acoustic emission parameters against types of defects and find their possible correlation. Strength diagnostics conducted for solder joints performed by throughhole technology on printed circuit boards by using methods of mechanical tests with simultaneous monitoring both mechanical characteristics and acoustic emission parameters allowed to find the relationship between parameters of acoustic emission and such defects of solder joints as “cold joint” and “low solder adhesion”. The pure bending technique has been developed to perform flexure tests on printed circuit boards, which provides equal testing stress condition over the printed circuit board and allows to estimate maximal acceptable load for nondestructive tests. The testing was considered to conduct in multiple load and unload cycles. The tests were conducted for the batch of double sided fiberglass foil laminated printed circuit boards, which were prepared and sorted into three equal groups by defects embedded into their solder joints. Acoustic emission data analysis indicated total count as the most informative parameter to correlate with various types of solder joint defects. Conducted experiments gave the reason to use identified character of acoustic emission to develop methods for strength diagnostics of solder joints on printed circuit boards. |
| Genre | Стаття |
| Topic | acoustic emission |
| Identifier | Kovtun I. Acoustic emission application for nondestructive strength diagnostics of printed circuit boards / I. Kovtun, J. Boiko, S. Petrashchuk // Вісник Хмельницького національного університету=Herald of Khmelnytskyi national university. Технічні науки : наук. журн. - Хмельницький, 2018. - № 1. - С. 12-17. |