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Title A comparison of reflectometry methods for location fault in telecommunication cables
 
Names Horiaschenko, K.L.
Zemlanskiy, O.E.
Горященко, К.Л.
Землянський, О.Е.
Date Issued 2017 (iso8601)
Abstract Aging wiring in buildings, transportation systems, consumer products and industrial machinery is among the
most significant potential causes of catastrophic failure and maintenance cost in these structures. Smart wire monitoring can
therefore have a substantial impact on the overall health monitoring of the system.
Well known reflectometry is commonly used for locating faults on wires and cables for a long time. This paper discuss
and compares several types of reflectometry methods as time domain reflectometry (TDR), frequency domain reflectometry
(FDR), mixed signal reflectometry (MSR), sequence time domain retlectometry (STDR), spread spectrum time domain
reflectometry (SSTDR) in terms of their accuracy, convenience, cost, size, and ease of use.
Common problems of TDR are the inability to see small reflections and errors in the velocity of propagation are sources
of errors. Other sources of errors in TDR are hardware errors – classical measurement error, where some variation in
measurements is seen, even without making any changes to the wire under test, its connection.
TDR is a most hardest in hardware realization because required highquality
generator with precise stability of width
and amplitude of pulses. FDR require lowfrequency
generator with sinusoidal waveform, but require large memory area to
store data from measuring process. All existing FDR methods do not allow eliminating "blind spots" at all.
As a result, advantages and limitations of each method are outlined and evaluated for cables. The results in this paper
can be extrapolated to other types of wire and cable systems.
Genre Стаття
Topic electrical wiring
Identifier Horiaschenko, K.L. A comparison of reflectometry methods for location fault in telecommunication cables [Текст] / K. L. Horiaschenko, O. E. Zemlanskiy // Вісник Хмельницького національного університету. Технічні науки. – 2017. – № 6. – С. 159-164.